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IRF6655
Absolute Maximum Ratings
Parameter
Max.
Units
P D @T A = 25°C
P D @T A = 70°C
P D @T C = 25°C
T P
T J
T STG
Power Dissipation
Power Dissipation
Power Dissipation
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
2.2
1.4
42
270
-40 to + 150
W
°C
Thermal Resistance
Parameter
Typ.
Max.
Units
R θ JA
R θ JA
Junction-to-Ambient
Junction-to-Ambient
–––
12.5
58
–––
R θ JA
R θ JC
R θ J-PCB
Junction-to-Ambient
Junction-to-Case
Junction-to-PCB Mounted
20
–––
1.4
–––
3.0
–––
°C/W
100
D = 0.50
10
0.20
0.10
τ J
SINGLE PULSE
Ri (°C/W) τ i (sec)
1.6195
0.000126
2.1406
0.001354
τ A
1
0.1
0.05
0.02
0.01
R 1
R 1
τ J
τ 1
τ 1
Ci= τ i / Ri
Ci= τ i / Ri
( THERMAL RESPONSE )
τ 2
R 2
R 2
τ 2
R 3
R 3
τ 3
τ 3
R 4
R 4
τ 4
τ 4
R 5
R 5
τ A
τ 5 22.2887 0.375850
τ 5
20.0457 7.410000
11.9144 99
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
0.01
1E-006
1E-005
0.0001
0.001
0.01
0.1
1
10
100
t1 , Rectangular Pulse Duration (sec)
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
Notes:
? Surface mounted on 1 in. square Cu board, steady state.
? Used double sided cooling , mounting pad.
? Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
? T C measured with thermocouple incontact with top (Drain) of part.
? R θ is measured at T J of approximately 90°C.
? Surface mounted on 1 in. square Cu
board (still air).
www.irf.com
? Mounted to a PCB with a
thin gap filler and heat sink.
(still air)
? Mounted on minimum
footprint full size board with
metalized back and with small
clip heatsink (still air)
3
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